CTIA’s TZM Alloy in Semiconductor Thermal Process Components

TZM alloy (Titanium Zirconium Molybdenum) is manufactured through powder metallurgy processes, including precise raw material control, uniform powder mixing, sintering, hot working, and precision machining, to achieve stable microstructure and excellent high-temperature performance. CTIA’s TZM alloy provides outstanding high-temperature strength, creep resistance, dimensional stability, and vacuum compatibility. It is widely used in semiconductor thermal process components, including load-bearing parts, support components, trays, fixtures, and other high-temperature structural components, meeting the requirements for stable operation of wafers and semiconductor materials under long-term high-temperature, vacuum, and thermal cycling conditions.

Advantages of CTIA’s TZM Alloy in Semiconductor Thermal Process Components
(1) Excellent High-Temperature Stability
Maintain high-temperature strength and structural stability with a melting point of approximately 2620℃, enabling reliable performance under long-term thermal loads during vacuum thermal processing.
(2) Good Dimensional Stability
Provide excellent creep resistance to reduce deformation during prolonged high-temperature operation and repeated process cycles, ensuring component dimensional accuracy.
(3) Strong Vacuum Compatibility
Deliver stable performance with low volatility and good high-temperature stability, meeting the cleanliness requirements of semiconductor equipment in vacuum environments.
(4) Reliable Thermal Cycling Reliability
Reduce thermal stress during repeated heating and cooling cycles through a coefficient of thermal expansion of approximately 5.5–5.9×10⁻⁶/K, improving long-term component service life.
(5) Precision Machining Requirements
Support complex semiconductor component manufacturing through precision machining based on equipment structures, installation requirements, and application conditions.

Applications of CTIA’s TZM Alloy in Semiconductor Thermal Process Components
(1) Wafer Thermal Processing Equipment
Used for wafer carriers, support components, and positioning structures to provide stable support under high-temperature conditions.
(2) Diffusion Furnaces and Annealing Equipment
Used for furnace trays, fixtures, and high-temperature structural components under long-term vacuum or protective atmosphere operation.
(3) Semiconductor Material Processing Equipment
Used for high-temperature load-bearing components and precision structural parts to ensure dimensional stability and clean processing environments.
(4) Advanced Electronic Material Manufacturing Equipment
Used for structural components in electronic functional material processing and high-temperature thin-film processing equipment to improve operational reliability.

Specifications of CTIA’s TZM Alloy in Semiconductor Thermal Process Components
(1) Product Forms: TZM plates, rods, blocks, and customized machined components.
(2) Dimensions: Customized machining is available for different sizes and complex structures.

CTIA GROUP has nearly 30 years of experience in molybdenum and molybdenum alloy manufacturing, with expertise in powder metallurgy and precision machining. CTIA provides TZM plates, rods, blocks, and customized high-temperature components for semiconductor thermal process applications, ensuring reliable performance under demanding vacuum and high-temperature conditions.

For any inquiry, please contact molybdenum and molybdenum alloy manufacturer: CTIA GROUP

Email: sales@chinatungsten.com

Tel: 0086 592 5129696 / 0086 592 5129595

Website: www.molybdenum.com.cn

WeChat: